What's New
What's new
No.10-0102
Issued: June 22, 2010
Release of High Thermal Conductive Thermoplastic Elastomer
"Thermolytic Elastomer CH Series"

With a long-term focus on the development of the elastomer for electronic devices, we have been approaching the market for the high thermal conductive thermoplastic elastomer, developed in coordination with the Osaka Municipal Technical Research Institute since last year. With a firm grip on the market needs, we are now launching our new product with enhanced grades.
Advances in performance and smaller space for electronic and LED devices have accelerated in recent years. Amidst the development of higher-density and thinner devices, thermal strategies are attracting attention as a way to ensure reliability.
In general, cooling of electronic and LED devices is achieved by releasing heat into the air through a high thermal conductive metal heat sink attached to a component. A high thermal conductive and soft thermolytic sheet (silicon sheet, gel) is used to fill in the gap (air layers) between the device and the heat sink, thereby improving cooling efficiency.
However, these thermolytic sheets are made of silicon and other thermoset resin, and they have had some problems, including: (1) they restrict the shape of the product, (2) they are expensive, and (3) they are non-recyclable.
Taking advantage of our unique thermoplastic elastomer combining technique and compounding technique, we inserted special soft thermal conductive filler in the thermoplastic elastomer, and developed the Thermolytic Elastomer CH Series for general-purpose, insulating, thermoplastic molding machines, with the thermal conductivity of 1 to 5 W/m・K.
Our product also comes with the following new features in addition to high thermal conductivity.

<Grade Deployment>

  1. Low Hardness Type (Hardness: HsA 10 (31E))
  2. Damping Type (tanδ 0.9; damping performance equivalent to butyl rubber)
  3. Semi-Hard Type (Hardness: HsA 97 (54D))

<Characteristics>

  • Siloxane-free
  • Excellent thermal conductivity (Thermal conductivity 1.0 to 5.0 W/m・K)
  • High insulation (equivalent to or exceed a silicon sheet (18 kV/mm))
  • Excellent vibration suppression (absorption) (tanδ 0.9; damping performance equivalent to butyl rubber)
  • Excellent compression property (less compression stress to peripheral components)
  • Excellent fire retardancy (equivalent to UL-94 V-0)
  • Excellent long-term heat and moisture resistance
  • More versatile shaping with injection molding in addition to extrusion
  • Accommodates general-purpose thermoplastic resin molding machines (with the use of a special soft thermal conductive filler)
  • Lower total cost
  • Recyclable

We are planning to leverage the features of these grades to develop uses in many fields, furthering deployment of our products.

Item Test Method Unit AR-CH-M0120
Soft
AR-CH-M0150D
High Damping
AR-CH-M0295
Semi-Hard
AR-CH-M0370
High Thermal Conductive
HsA
(after 1 sec.)
JIS K 6253A Point 10(31E) 48 97(54D) 70
Specific Weight JIS K 7112 - 1.88 1.92 2.22 2.32
Tension Strength JIS K 6251 MPa 0.2 0.6 2.3 0.9
Stretch Rate JIS K 6251 % 930 1260 450 140
Thermal Conductivity (@23℃)
Thickness Direction
Laser Flashing W/m・K 1.5 1.5 2.5 3
Volume Resistivity JIS K 6911 Ω・cm >1014 >1014 >1015 >1015
Dielectric Breakdown Strength JIS K 6249 kV/mm 17 22 23 20
Fire Retardancy UL(t=1.0mm) - V-0 equivalent V-0 equivalent V-0 equivalent V-0 equivalent
tanδ(25℃) 30Hz-5℃/min - 0.5 0.9 - 0.3
Sheet Thickness - mm 0.2 - 6.0 0.2 - 6.0 0.2 - 6.0 0.2 - 6.0
The End